Tezzaron Semiconductor Corporation develops high-speed memory products, 3D wafer stacking processes, and 3D memory elements for the semiconductor industry. The company offers everything from known-good 3D memory stacks the size of a single die to fully tested and packaged processor/memory systems on chips (SoCs). The company has produced extremely fast memory prototypes and is now building Static random-access memory (SRAM) replacement parts with standard interfaces. Tezzaron has also demonstrated the world's first successful wafer-stacked 3D integrated circuits (ICs), including stacked microprocessors, stacked sensors, and stacked SRAM devices. The company operates in Illinois, North Carolina, and Texas.
