Tezzaron proposes to create a microprocessor device based on an ARM M0 processor designed to be fabricated in the Honeywell S150 Rad-Hard SOI semiconductor process. The device will be designed for both stand alone and 3D circuit integration. In a 3D application the device can be die to wafer or wafer to wafer assembled providing a core set of SOC processor functions.
Benefit: An ARM M0 processor device that is hardened has broad applicability to the Mil-Aerospace market. The performance of the M0 processor makes it a good candidate for real time flight control and the 3D integration feature can provided unparalleled performance at low power.
Keywords: ARM M0, Rad-Hard, 3D
