
k-Technology Corporation (AKA: a divison of Thermacore) Profile last edited on: 1/14/2016
CAGE: 09RK9
UEI:
Business Identifier: Thermal Management Systems Is this YOUR Company?
Ensure accuracy and completeness of YOUR Company Profile by completing the brief Survey Instrument attached
Do you know about this Awardees?
Let us encourage you to provide any data which would enhance the completeness of this firm's profile.
Location Information
780 Eden Road
Lancaster, PA 17601
Lancaster, PA 17601
Location: Multiple
Congr. District: 11
County: Lancaster
Congr. District: 11
County: Lancaster
Public Profile
In August 2009, K Technology Corporation was acquired by Thermacore, Inc. - itself an SBIR active firm. k Technology Corporation (kTC) designs and manufactures thermal management products for cooling high power density electronic packaging and other applications requiring high performance heat transfer. The firm is involved in development of passive high-conductivity thermal components. These components have conductivities 3 and 5 times that of copper and aluminum, respectively. In applications where performance is limited by operating temperature, kTC's products enable electronic packages to operate at significantlty higher power levels or to be significantly reduced in size and weight.
Extent of SBIR involvement
Synopsis: Awardee Business Condition
Employee Range
15-19Revenue Range
1.5M-2MVC funded?
NoPublic/Private
Privately HeldStock Info
----IP Holdings
N/AAwards Distribution by Agency
Most Recent SBIR Projects
Year | Phase | Agency | Total Amount | |
---|---|---|---|---|
2010 | 2 | NASA | $699,514 | |
Project Title: Integrated Composite - Heatpipe Radiator Panel | ||||
2010 | 2 | AF | $849,135 | |
Project Title: Highly Isothermal Composite - Heatpipe Radiator Panel | ||||
2009 | 1 | AF | $99,917 | |
Project Title: Advanced Electronic Cooling Technologies | ||||
2009 | 1 | MDA | $99,901 | |
Project Title: Improved Packaging and Thermal Management for High Power Electronics and Solid State Lasers | ||||
2009 | 1 | DARPA | $98,637 | |
Project Title: Energy Rejection Systems for Very High Altitude Aircraft |
Key People / Management
Thomas G Cassin -- President
James M Marder
Himanshu Pokharna
Adam Rosen
James M Marder
Himanshu Pokharna
Adam Rosen
Company News
There are no news available.