Traditionally satellite thermal control systems must be vigorously designed, analyzed, tested and optimized for every mission. This reinvention of the wheel is costly and time-intensive. Innovative solutions that enable isothermal satellite structures (less than 5K delta temperature across a 1m2 panel) and inter-panel connections are needed (less than 3 K delta temperature across joints). kTC proposes a general technology development that permits the design of a high performance thermal distribution panel (TDP) concept. The processing technologies proposed to build such a panel can also be used to produce this panel with high structural stiffness, similar to aluminum honeycomb type structures. This advanced TDP material concept will have high conductance the will obviate the need for attached bulky metal thermal doublers. This material can provide efficient conductive heat transfer and permitting the use of thinner panel thicknesses. The phase I work will concentrate on the design of a demonstration article, the selection and processing of the panel constituent components, the fabrication and assembly of the TDP, and its evaluation.
Benefit: The high conductance material to be demonstrated under this program would have immediate applications in Air Force systems, as well as other military, NASA, and commercial uses. Key potential post application relies heavily on the successful verification and certification of the proposed materials performance. The technology will also be attractive to high performance commercial (space based) applications.
Keywords: Thermal Management, Thermal Bus, Electronic Packaging, Composites