
Nanoscale Conformable Thermal Interface Materials with Electronically Enhanced Heat ConductionAward last edited on: 10/12/2011
Sponsored Program
STTRAwarding Agency
DOD : AFTotal Award Amount
$99,346Award Phase
1Solicitation Topic Code
AF09-BT22Principal Investigator
Ali DhinojwalaCompany Information
ADAP Nanotech LLC
526 South Main Street Suite 821
Akron, OH 44311
Akron, OH 44311
(330) 701-5983 |
info@adapnanotech.com |
www.adapnanotech.com |
Research Institution
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Phase I
Contract Number: ----------Start Date: ---- Completed: ----
Phase I year
2010Phase I Amount
$99,346Benefit:
The continued increase in speed of the microprocessors and the need to dissipate heat from these devices has imposed serious road blocks in designing future processors. The technology developed at Akron and Rice, inspired by geckos, offers the possibility of improving the heat transfer across the interface using soft and compliable carbon nanotubes. ADAP Nanotech is Start-up Company founded by the PI''s who have developed the gecko-inspired carbon nanotube adhesives. This new company has the support of the University of Akron, Research Foundation, and local business agencies, such as Glide and Jump-Start, to commercialize this technology. We anticipate the benefits of this technology in the areas of dry adhesives, thermal interface materials, coatings, and nanocomposites.
Keywords:
Carbon Nanotubes, Heat Conduction, Gecko, Adhesion, Self Cleaning
Phase II
Contract Number: ----------Start Date: ---- Completed: ----