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ADAP Nanotech LLC Profile last edited on: 7/2/2019
CAGE: 5T8L5
UEI: FBQ5K349TN11
Business Identifier: Vertically aligned carbon-nanotube (VACNT) based*, thermally and electrically conductive adhesives and coatings Is this YOUR Company?
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Location Information
526 South Main Street Suite 821
Akron, OH 44311
Akron, OH 44311
(330) 701-5983 |
info@adapnanotech.com |
www.adapnanotech.com |
Location: Single
Congr. District: 11
County: Summit
Congr. District: 11
County: Summit
Public Profile
ADAP Nanotech, LLC specialize in the development and manufacture of carbon nanotube based adhesives and coatings that have a variety of applications including serving as high performance thermal interface materials (NanoTIM) that can facilitate cooling of heat generating electronics. The firm offers NanoTIM, a carbon nanotube based thermal interface material that is available as a thermal pad, which is applied to processors; NanoStick, a dry adhesive that sticks and unsticks repeatedly without getting soiled in applications, such as wall-climbing robots; and UltraBlack, a coating system for light absorption over wide frequency range in applications, including pyroelectric detectors, thermoelectric devices, and solar heaters. The company also develops conductive superhydrophobic coatings, provides solutions to material problems, and sets-up and designs chemical vapor deposition systems. ADAP's NanoTIM micro-patterned aligned nanotube structures are based on gecko-inspired, CNT-based adhesives jointly developed by ADAP's NanoTIM micro-patterned aligned nanotube structures are based on gecko-inspired, CNT-based adhesives jointly developed by University of Akron and Rice University.
Extent of SBIR involvement
Synopsis: Awardee Business Condition
Employee Range
1-4Revenue Range
Less than .5MVC funded?
YesPublic/Private
Privately HeldStock Info
----IP Holdings
20-24Awards Distribution by Agency
Most Recent SBIR Projects
Year | Phase | Agency | Total Amount | |
---|---|---|---|---|
2010 | 1 | AF | $99,346 | |
Project Title: Nanoscale Conformable Thermal Interface Materials with Electronically Enhanced Heat Conduction |
Key People / Management
Ali Dhinojwala -- Chief Technology Officer/ Founding Director
Sunny Sethi -- Co-Founder
Sunny Sethi -- Co-Founder