SBIR-STTR Award

Monolithic InfraRed pixel structures enabled by Thyristor-HFET EO logic
Award last edited on: 12/2/2009

Sponsored Program
SBIR
Awarding Agency
DOD : AF
Total Award Amount
$849,896
Award Phase
2
Solicitation Topic Code
AF083-207
Principal Investigator
Jianghong Cai

Company Information

ODIS (AKA: ODIS Inc~POET Technologies Inc~OPEL Technologies Inc~Opel Solar)

Three Corporate Drive
Shelton, CT 06484
   (860) 450-8407
   poet@grayling.com
   www.odisinc.com/
Location: Single
Congr. District: 04
County: Fairfield

Phase I

Contract Number: ----------
Start Date: ----    Completed: ----
Phase I year
2009
Phase I Amount
$99,992
The digital signal processor is currently dominated exclusively by CMOS technology. This is largely due to the fact that it is the only low power (VLSI density) technology available. However, CMOS is near the end of its scaling potential and it has a severe liability for space applications due to a weakness to radiation.  Recent progress in integrated optoelectronics has indicated dramatic performance improvements in clock and data recovery and in the mux/demux operations are possible. This may also apply to digital logic functions. For example the basic flip flop function could be implemented with EO devices activated by optical signals and producing optical outputs.  Such approaches could reduce the number of devices and the power while simultaneously increasing the speed. ODIS proposes a new technology base to enable this digital flip flop implementation. The latching function is provided by an EO thyristor which produces laser light in the on state. Optically activated transistors control the switching functions. This approach is compatible with optical signal transport, with on chip optical clock generation and timing control and with optical I/O. In this work, ODIS will develop J-K flip flops and their related synchronous circuits based on a new GaAs optoelectronic integration platform.

Benefit:
The digital processor market is several billion dollars with steady growth potential based upon an expending PC industry. As CMOS is constrained by power and speed , the opportunity for GaAs based circuits is significant. The wireless industry is already using all of the GaAs amplifiers that are produced. One can therefore expect a market opportunity for GaAs based digital products with large up-side potential. Digital products can now be added to a growing number of markets addressed by integrated optoelectronics  including AD converters, imager products, parallel optical data links, optical interface circuits, phased array receivers and other markets currently dominated by Si.  

Keywords:
Thyristor Photo-Hfet Modulation Doped Optoelectronic Integrated Circuits Optical Clocking Race Condition Optical Interconnect Flip Flop

Phase II

Contract Number: ----------
Start Date: ----    Completed: ----
Phase II year
2010
Phase II Amount
$749,904
IR imagers currently require hybrid read-out integrated circuits (ROIC’s)and additional separate AD converters (ADC) to provide transmittable data formats to digital signal processors (DSP’s). The DSP is currently dominated exclusively by CMOS technology as the only high density low power technology. New capabilities for IR imaging based on GaAs are being developed which have the potential for monolithic ROIC’s. However the advantage of the monolithic pixels increases enormously if digitization could also be realized within the chip. To this end, a special requirement is to develop and optimize the IR pixel simultaneously with the ADC. ODIS has identified a unique opportunity to implement novel multi-wavelength pixel designs together with a ÓÄ ADC in which the true ÓÄ performance can only be realized with a high speed decimator. At 60GB/s bit rates, the only solution to the decimator is EO logic. The pixel response is based upon intersubband absorption with CCD read-out transfer. The EO logic is based upon the unique thyristor properties. The combination of these functions monolithically will result in unrivalled IR capability. In this project, ODIS will optimize the pixel response and readout amplifiers in a planar technology platform that supports the EO logic needed for the decimation.

Benefit:
The digital processor market is several billion dollars with steady growth potential based upon an expanding PC industry. The IR imager market will realize huge growth with the availability of monolithic pixel and ROIC combinations. A market opportunity thus exists to produce IR imagers supported by EO logic circuits. The market share for GaAs based digital products in the multi-GB/s range will expand dramatically. Digital and imaging products can now be added to a growing number of markets addressed by integrated optoelectronics including parallel optical data links, optical interface circuits, phased array receivers and other markets currently dominated by Si.

Keywords:
Thyristor Ir Pixel Intersubband Absorption Optoelectronic Integrated Circuits Optical Clocking Responsivity Optical Interconnect Flip Flop