Electronic component failure occurs at three distinct levels: chip or device level, circuit board, and the interconnection between device and circuit board. Current non-invasive techniques for circuit board testing provide prognostic capabilities and replace the functional stimulus tests employed in electronic component performance evaluation. However, large variations in location, size and elemental composition of printed circuit board components present significant obstacles to comprehensive non-invasive testing of PCBs for failure. To address this problem, in Phase I we investigate and design a suite of multi-resolution, laser-based, non-invasive imaging techniques that utilizes a range of the frequency spectrum consistent with the requirements for probing at the resolutions indicated by the scale of component features. Each technique identifies and characterizes the material faults at a specific level (device, board, or junction) that contribute to failures. These techniques are complementary as they are laser based imaging techniques that expose various levels of resolution and failure modes that are not identifiable with any single technique. Phase II research involves the development of a prototype system containing these test technologies and is suitable for field-use.
Keywords: Ate, Laser, Test, Uut, Tps, Test Program Set
