Formerly known as Tru-Si Technologies, the firm's name was changed to ALLVIA, Inc. in 2004. ALLVIA, Inc. provides silicon interposer and through-silicon via (TSV) foundry services to semiconductor, optoelectronics, and MEMS industries. The company offers vertical interconnects, 2.5D and 3D IC design, system-in-package, and 3D internet software development solutions. Its services include TSV development and foundry, frontside/filled vias, backside/conformal vias, redistribution layers and RDL, silicon interposer design and manufacturing, via deep etching, via copper filling, via backside opening, via die attaching, and via die attaching/bumping.
