Company Profile

Sensorcon Inc
Profile last edited on: 11/2/18      CAGE: 3X8D2      UEI:

Business Identifier: MEMS technologies sensors
Year Founded
2003
First Award
2005
Latest Award
2009
Program Status
Inactive
Popularity Index
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Location Information

150 North Airport Drive
Buffalo, NY 14225
   (716) 566-2728
   sales@sensorcon.com
   www.sensorcon.com
Location: Single
Congr. District: 26
County: Erie

Public Profile

Sensorcon has developed a new process to bond wafers in a low cost manner, allowing electrical integration of multiple devices in a vertical fashion. The process combines state-of-the-art techniques in semiconductor processing with a wafer bonding process that the company recently developed. The technique allows for the complete integration of MEMS devices at the wafer level, rather than the traditional method of die level integration

Extent of SBIR involvement

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Synopsis: Awardee Business Condition

Employee Range
5-9
Revenue Range
.5M-1M
VC funded?
No
Public/Private
Privately Held
Stock Info
----
IP Holdings
1-4

Awards Distribution by Agency

Most Recent SBIR Projects

Year Phase Agency Total Amount
2009 1 AF $100,000
Project Title: High Power Carbon Ultracapacitor
2008 1 DARPA $99,000
Project Title: Nanotechnology-Enhanced Sensor for Toxic Industrial Chemicals
2006 2 DARPA $849,000
Project Title: Novel Low-cost Methods for Fabricating Compact, Vertically Integrated MEMS

Key People / Management

  Mark Wagner -- President

Company News

There are no news available.