ReMetal LLC, is a materials science firm focused to enable use of metal alloys designed to support the cooler functioning of modern hi-tech electronics and integrated circuits. For electronic package designers, the need quickly to dissipate excess heat has become the priority. The standard silver, copper and aluminum tend to heat the semiconductors too much, which may damage the item. Therefore ReMetal is focused on a single task â help modern hi-tech electronics to run cooler. The drive for miniaturization pushes operating temperatures of modern integrated circuits (ICs or chips) to their physical limits. Each additional degree of temperature spells exponentially shorter time between IC failures. A well-proven approach to heat dissipation is to use high thermal conductivity materials as heat spreaders, heat sinks and base plates or substrates in IC packages. However, as currently used metals heat up they expand much more than silicon or other semiconductor chip materials. Thsi type of expansion mismatch puts too much stress on semiconductor chip attached to a heat spreader and can ultimately destroy the chip. It is the judgment of ReMetal founders that there is urgent need for new materials and technologies engineered to dissipate heat as well as - or may be better than - metals and which, ideally, can at the same time also control thermal expansion.
