
Omega Micro Technologies Inc (AKA: Omega Wireless Solutions Inc) Profile last edited on: 10/25/2018
CAGE: 3N1K2
UEI: U8DMHT815P84
Business Identifier: Electroless nickel gold plating process allowing fabrication of low temperature co-fired ceramic substrates Is this YOUR Company?
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Location Information
3495 Kent Avenue Suite M100
West Lafayette, IN 47906
West Lafayette, IN 47906
(765) 775-1011 |
info@omegamicrotech.com |
www.omegamicrotech.com |
Location: Single
Congr. District: 04
County: Tippecanoe
Congr. District: 04
County: Tippecanoe
Public Profile
Omega Micro Technologies, Inc is a semiconductor and engineering firm that has developed a proprietary electroless nickel gold plating process for fabrication of high-reliability, low-temperature co-fired ceramic substrates used in electronic devices and modules. The process utilizes a multilayer ceramic substrate constructed with silver conductors, which are then electrolessly plated with nickel, followed by a thin layer of gold. This is opposed to traditional high-reliability, low-temperature co-fired ceramic substrates for electronic modules, which utilize gold exclusively for all conductors within the substrate. The nickel gold plating process is able to provide a high-reliability substrate that allows for a cost savings of anywhere from 40 70% over a comparable substrate fabricated with all gold conductors. The cost of the nickel gold plated substrate is comparable with traditional commercial substrates fabricated with all silver conductors but is still able to produce reliability that approaches that of substrates fabricated with all gold conductors, allowing the process to be used widely throughout the military marketplace with considerable cost savings to the U.S. military and armed forces. The cost savings potential of the new process will allow low-temperature co-fired ceramic substrates and modules, with their superior performance and enhanced capabilities, to be directly cost competitive with lower performance, cheaper substrate technologies such as high temperature co-fired ceramic and potentially laminate and polymer material sets. Researchers for Omega Micro Technologies have been working with officials from various U.S. Department of Defense (DoD) Original Equipment Manufacturers (OEMs), as well as under a contract with the Indiana Radio Frequency Alliance and Crane Naval Surface Warfare Center in southern Indiana in order to evaluate and characterize the performance and reliability of Omega Micro Technologies' plating process under standard military environmental operating conditions.
Extent of SBIR involvement
Synopsis: Awardee Business Condition
Employee Range
5-9Revenue Range
.5M-1MVC funded?
NoPublic/Private
Privately HeldStock Info
----IP Holdings
N/AAwards Distribution by Agency
Most Recent SBIR Projects
Year | Phase | Agency | Total Amount | |
---|---|---|---|---|
2016 | 1 | Navy | $79,999 | |
Project Title: Miniaturized Integrated Power Combiner | ||||
2016 | 1 | AF | $149,997 | |
Project Title: Low Cost High Temperature Multilayer Ceramic Modules | ||||
2013 | 2 | Navy | $1,149,920 | |
Project Title: High Thermal Performance Gallium Nitride Power Amplifier and Transmit/Receive Module Packaging | ||||
2011 | 1 | Navy | $70,000 | |
Project Title: Wideband Low-loss Tunable Band-Pass Filter (BPF) | ||||
2008 | 2 | Navy | $1,398,673 | |
Project Title: UHF to L-Band Linear Amplifier 3-D Dielectric Material Enhancements |
Key People / Management
Jacob L Smelser -- President; Senior Design Engineer
Joel Derby -- Design Engineer - RF / Digital / Microwave
Phillip Fisher -- Senior Process Engineer
Bob Salisbury -- Senior Process Engineer - Packaging / Plating
Jason Warner -- Senior Process Engineer - Production / Equipment
Joel Derby -- Design Engineer - RF / Digital / Microwave
Phillip Fisher -- Senior Process Engineer
Bob Salisbury -- Senior Process Engineer - Packaging / Plating
Jason Warner -- Senior Process Engineer - Production / Equipment