Spun out of RTI Internation in 2004, Nextreme designs and manufactures micro-scale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries.The company has embedded cooling and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging. After the company was acquired by Laird Technologies in 2013, in December of that yea, the firm was renamed Laird Durham, Inc.
