A spin-off from MIT, two Project JETS team members formed JetCool Technologies to address high-performance cooling to new application areas. Working with leading innovators worldwide to transform next-generation product development, the principals are focused on improving high power electronic efficiency and performance: high performance cooling technology for high power electronics. The firm's low SWAP heat sinks cool the most power dense semiconductors. Integrating our small solutions within the chip or add them to an existing package. Heat dissipating solutions for RF devices, laser diodes, and data center processors.
