Fraivillig Technologies Company's technology enables the heat-sealing of electrically-isolated copper foil or printed circuitry to aluminum heat sinks --allowing the soldering of power devices directly to heat sinks-- and provides: * Very high thermal transfer -- resistance of only 0.1 degC-sqin/W, or a thermal transfer rate of 2-5X that of conventional insulator pads -- with NO attachment hardware.* Decreased power device operating temperature. Example: 2 degC/W savings for TO-220 vs conventional alumina-filled insulator pad. * Formats for most applications (patented, trademarked FT products): POWERSITE -- mounting discrete devices POWERFLEX -- bonded printed circuits on heat sinks POWERVIA -- solid-metal thermal vias in PCBs * Dielectric reliability -- thin, ceramic-filled Kapton* MT film. * Durable bonding -- very thin coating of thermoplastic polyimide adhesive (only 4 microns per side) that withstands severe continuous operating temperatures, thermal shock, thermal cycling, 85/85. * Cost-effective, single-unit production -- the thermoplastic polyimide adhesive bonds quickly during the high-temperature heat-sealing process. * Enhanced design options -- higher power rating, increased ambient rating, more reliable and/or fewer power devices, elimination of attachment hardware, no pressure dependency (for thermal transfer), flexibility and off-plane connections
