EOTRON was founded to develp a high power silicon diode laser stack for MEMS fabrication, which required a particular approach to dissipating waste heat. In order to address this problem, the company has a developed patent pending technology for a highly efficient cooling package that can be applied in the photonics and electronic industries. EOTRON's cooling package has a unique package structure for high density 3D liquid and air cooling. The patent pending design for the silicon package delivers superior cooling efficiency, reliability and lower manufacturing costs for components used in the electronic and photonics industry. Eotron currently has over 20 awarded patents related to active and passive cooling using 2D and 3D silicon structures, with another 20 or more pending.
