Enervana Technologies LLC (Enervana) is a start-up company based on a decade of research carried out at Louisiana State Universitys Department of Mechanical Engineering (LSU ME). An initial product focus is cooling of microelectronic modules. Due to dramatic growth in module-level heat output, intense current interest exists for advanced cooling technologies. It is recognized that conventional forced air cooling will be insufficient for the more integrated, higher performance chips. Alternative, high-efficiency, cooling technologies have become a must-have for the next generation personal and mainframe computers. The core competency of Enervana Technologies is products for low-cost micro fabrication, micro joining, assembly, and device/system performance testing. This core technological competency is evidenced by a series of publications in leading archival technical journals in the field, protected through an intellectual property (IP) portfolio consisting of issued and pending U.S. patents, and continuously strengthened through new technology disclosures and new patent applications.
