Electrochemical Systems, Inc. ("ECSI") design, build and supply efficient, precision benchtop wet processing equipment for electroplating, electroforming, electrocleaning and etching of metal microelectromichanical sytems (MEMS) and high density interconnects (HDI) in academic, R&D and manufacturing applications. FIBRotools are ideally suited for optimized electroplating of wafers and wafer sections in semiconductor, MEMS, NANO and advanced high density interconnects and electronics packaging fabrication. ECSI's FIBRo technology enables ECSI to produce their products at a low cost. Complemented by advanced wafer-holder design, FIBRo produces uniformity, eliminates bubbles and minimizes edge effect. FIBRo is based on discoveries by founder and CEO, Igor V. Kadija.
