SBIR-STTR Award

MicroEnergy Technologies, Inc. (MicroET) and the University of Washington propose to demonstrate the feasibility and the major advantages of a unique high heat flux cooling module which combines innovations in heat rejection with innovative rosette pump design to achieve heat rejection rates in excess of 1000 W/cm2 from the surface of a substrate. The most critical innovation is the use of ceramic nanoparticles suspension (i.e., SiC or aluminum oxide nanofluid) used as the heat rejection medium in which intense nucleate boiling produce extremely high heat fluxes. The piezoelectric rosette micropump geometry is integrated into the rosette cooling module to maintain a high enough flow rate through the parallel array of microchannels for efficient cooling. The proposed approach allows for distributed cooling of the electronics without the need for external pumping and the ability to provide localized control. During Phase I, we will perform analytical and computational modeling for system design and analysis, experimentally demonstrate the significant advantages and improvements in cooling system performance. The final product, ultra high heat flux thermal management system, in addition to application in defense technologies, will have a significant commercial value to a broader industry, including the aerospace and space electronics manufacturers. Efficient distributed cooling will reduce the risk of system failure, increase system throughput, and reduce the complexity, size, and weight of the system

MicroEnergy Technologies is developing an autonomous cooling module, capable of removing waste heat fluxes of up to 1000 W/cm^2 from electronics and other devices. The cooling module will utilize an extremely efficient microchannel heatsink geometry and two-phase (boiling) flow to maximize heat transfer rates. The heat transfer will be further enhanced through the use of nanofluids with uniquely beneficial thermophysical properties. The module will utilize a number of technological innovations to create a self-pumped device that requires no electrical power input. The combination of these technologies will result in a compact, robust, high-performance cooling module that can be adapted to a wide range of thermal management problems. Phase II will build on the foundations of technological feasibility laid during Phase I, with the ultimate goal of creating a working prototype of an autonomous cooling module. This development work will lead us to a series of design guidelines that will be used to create one or more commercializable products during Phase III of the project.

Keywords:
COOLING, THERMAL MANAGEMENT, HIGH HEAT FLUX, POWER ELECTRONICS, SELF-PUMPED, MICROCHANNEL, PHASE CHANGE, NANOFLUID