SBIR-STTR Award

This Small Business Innovation Research Phase I research project will extend the capabilities of magnetic current imaging to detect open failures in semiconductor packages with an accuracy of 30 microns to facilitate the integration of semiconductor components and devices into systems. The largest, most difficult problem encountered in packages is electrical opens due to increasing shrinking and complex technology in leading edge designs. The only available techniques are time domain reflectometry with practical resolution of 1-2 mm and time consuming layer-by-layer deprocessing. It is proposed to use magnetic current imaging with a SQUID sensor to solve this critical problem through increasing the frequency detection limit of the equipment to detect high frequency signals at the defect location. The semiconductor industry has a critical need for localization of buried open defects in packages with resolution below 30 microns. The proposed technology is targeting a 30 micron resolution to fill a known gap in fault isolation technology for packaging. For the semiconductor companies it will enable the packaging manufacturing sites to isolate open defects and improve their manufacturing processes to minimize or eliminate these defects quickly so that they can get high quality reliable products to market faster

This Small Business Innovation Research (SBIR) Phase II research project will enable detection of open circuit failures in semiconductor packages and integrated circuits with an accuracy of 10 microns by extending capabilities of magnetic current imaging. This has been one of the most difficult problems encountered by the industry today due to increasing complexity and shrinking of leading edge designs. The only technique available today is time domain reflectometry with practical resolution of 1-2 mm and time consuming layer-by-layer deprocessing. There is a critical need for a faster, non-destructive and more reliable technique capable of locating opens at a level commensurate with package level wiring approaching 10 microns pitch. It is proposed to use magnetic current imaging with a Superconducting Quantum Interference Device (SQUID) to solve this critical need by analyzing high frequency signals effects at the defect location. It is expected that this approach will be able to detect opens with a resolution of about 10 microns. The broader impacts of this research are: it will enable semiconductor companies to bring product to market faster and with greater reliability by rapidly finding and eliminating sources of open defects; it will benefit the nation by accelerating the introduction of advanced electronics that continuously improve quality of life for consumers, and bring opportunity gains that enhance the competitiveness of American industry