SBIR-STTR Award

Micro-Coax Manufacturability Study
Award last edited on: 11/13/2006

Sponsored Program
SBIR
Awarding Agency
NSF
Total Award Amount
$599,354
Award Phase
2
Solicitation Topic Code
-----

Principal Investigator
Sean Cahill

Company Information

Bridgewave Inc (AKA: Bridgewave Communications Inc)

3350 Thomas Road
Santa Clara, CA 95054
   (408) 567-6900
   info@bridgewave.com
   www.bridgewave.com
Location: Single
Congr. District: 17
County: Santa Clara

Phase I

Contract Number: ----------
Start Date: ----    Completed: ----
Phase I year
2005
Phase I Amount
$99,354
This Small Business Innovation Research (SBIR)Phase I research project is aimed at advancing the capability to create high bandwidth interconnects for increasingly higher frequency digital and analog electronics systems. The technology is applicable to printed circuit board, as well as device-level interconnects. The proposed innovation applies conformal coating of polymeric and lithographically defined metallic layers onto conventional wire bonds to produce coaxial interconnect structures. As compared to conventional wire bonds, the resulting micro-coaxes have bandwidths improved by more than an order of magnitude, cross-talk nearly eliminated, impedance matched, and phase distortion significantly reduced. The objective of the current phase is to advance the micro-coax from the current laboratory prototype stage, toward volume manufacturability. To accomplish the objective, improved understanding of the dielectric coating processes, via generation, and lithography steps is needed. Further evaluation of the transition from board-level to device-level is needed. Geometry and materials limitations on performance must be better understood. The goal of the research is to establish certain desirable performance milestones for the technology. Such milestones include demonstration of parallel interconnects with 100+ GHz bandwidth, better than 0.5 dB/cm loss, 300 um center-to-center spacing, and >40 dB isolation. If successful the ability to create micro-coax capabilities n would lead to high bandwidth, high frequency interconnects for semiconductor industries as well as testing and assembly industries. Optical communications protocols, which pass data at 40Gbit/sec, requiring 20GHz fundamental frequencies, and even higher frequency overtones for accurate signal reproduction will need semiconductor products that support coaxial-like transmission rates. Today's ICs are becoming millimeter-wave devices and will stall without packaging and interconnect innovation. The proposed micro-coax offers bandwidth from DC to 100GHz and beyond with a very small form factor. Microcoaxes will also have significant impact on IC associated industries. IC probing, test, and assembly industries will be stimulated by infusion of new technological solutions

Phase II

Contract Number: ----------
Start Date: ----    Completed: ----
Phase II year
2006
Phase II Amount
$500,000
This Small Business Innovation Research (SBIR) Phase II research project deals with the ever-increasing burden placed on the microelectronics industry as computational speeds increase. While the number-density-speed of transistors doubles every 18-24 months (a phenomenon known as Moore's Law), the ability to retrieve and store data from external sources is not increasing nearly as quickly. The performance improvement rate of key computing tasks such as simulation, signal processing and database searches is becoming limited by off-chip bandwidth. Approaches such as "flip-chip bumping" are not a panacea, because despite their small size, these structures leak signals to one another; a significant performance detriment. The company has developed a novel MicroCoax interconnect technology to address these problems, utilizing existing semiconductor manufacturing infrastructure. The research objectives are to gain insights into MicroCoax fundamentals and understand application specific issues within market segments that are most impacted by current technological limitations. Research will focus on continuing exploration of MicroCoax material set, process flow, integration, and reliability, along with specific application to three distinct market spaces namely, MMICs, High-speed Digital/Optoelectronics, and high-frequency test.

Electronics technology impacts nearly every person on earth in some way. Even folks living in remote places are subject to natural disasters, which may be predicted by atmospheric and geological simulation and warning systems, allowing timely evacuation. Goods distribution and logistics are increasingly dependent on computationally intensive database search and tracking. Medical diagnosis and treatment rely increasingly on signal processing for imaging and therapeutics. High-bandwidth wireless systems allow for recovery of communication infrastructure following floods and hurricanes. All of the aforementioned technologies have high-speed electronic systems at their core, and MicroCoax can affect them all. High-bandwidth systems are quite expensive today, in large part because of interconnects based on machined waveguides and significant labor content associated with such approaches. If successful the proposed technology, MicroCoax, can eliminate much of the cost, making such systems more commercially viable and ubiquitous. While a disruptive technology such as MicroCoax will be invisible to the average user, electronics designers and will be able to expand their application horizons due to elimination of prohibitive cost constraints. Electronics, semiconductor, communications and related industries will stall without continued innovation in packaging and interconnect strategies. The economic implications are significant, as worldwide electronics sales number somewhere around US$1.3 trillion at this time.