In the Phase 1 program, ENGIN-IC studied the key technologies to develop a 200-W Solid State Power Amplifier (SSPA) utilizing novel, highly efficient GaN HEMT MMICs, low loss combiners, and manufacturing techniques to minimize the size of the SSPA module. In Phase 2, ENGIN-IC will advance these designs with high TRL level demonstrators. A GaN MMIC amplifier with 32-W saturated output power, 25-dB large signal gain and 48 to 52% power-added-efficiency (PAE) will be demonstrated. Modular sub-assemblies with more than 60-W output power and 45% efficiency will be demonstrated, using this MMIC. These sub-modules will be combined through a low-loss waveguide combiner resulting in a SSPA with more than 200-W output power and 40% efficiency across the specified Ku-Band frequency range. Hybrid packaging techniques allow for a compact modular integrated microwave assembly with an innovative cooling approach to maintain reliable operation through extreme environments. The technologies will be qualified with testing to extreme program environments and will be available for immediate use in production systems. These technologies solve key system issues including high efficiency amplifier power generation and density, cooling, size constraints, and low loss combining. These technologies can all be adapted to support future system acquisition objectives through scaling of MMIC frequencies, bandwidth, output power, and module combining quantities.
Benefit: The project will result in a significant improvement to transmitter efficiency, size and cost for Ku-band power amplifiers which will provide a significant advantage to radar sensor applications. The new SSPAs will have far greater reliability and sustainability than a traveling wave tube approach, while achieving key performance characteristics. As well as the military applications for radar applications mentioned, there are many commercial and space applications for all or portions of this approach. These include deep space exploration, missile seeker transmit PAs, commercial airline SATCOM for connectivity when flying overseas, and many more. As noted in the proposal, there are prime suppliers that are very interested in the technology.
Keywords: SSPA, transmitter, GaN MMIC, Ku-Band, High efficiency, Radar, Integrated microwave assembly (IMA)