SBIR-STTR Award

Novel Temperature and Vibration Tolerant Packaging for Inertial Sensors (MEMS)
Award last edited on: 10/25/2018

Sponsored Program
STTR
Awarding Agency
DOD : Navy
Total Award Amount
$1,649,851
Award Phase
2
Solicitation Topic Code
N12A-T008
Principal Investigator
Sang Woo Lee

Company Information

ePack Inc

3830 Packard Road Suite 120
Ann Arbor, MI 48103
   (734) 882-2853
   info@epackglobal.com
   www.epackglobal.com

Research Institution

University of Michigan

Phase I

Contract Number: N00014-12-M-0379
Start Date: 6/25/2012    Completed: 4/26/2013
Phase I year
2012
Phase I Amount
$149,959
The objective of the proposal is to demonstrate the feasibility of a generic package that provides high vacuum, temperature control and vibration isolation for a wide range of high performance (tactical and navigation grade) micromachined inertial sensors. Inertial sensors (accelerometers and gyroscopes) are now widely used in consumer and industrial applications. However, for high performance navigation and targeting applications there are several packaging challenges which act as roadblocks to their commercialization including: i) their need for low vacuum pressures (

Benefit:
High performance (tactical and navigation grade) inertial sensors are a key technology for next generation navigation and targeting systems and will replacing much larger (> 100 times larger) ring laser gyroscopes (RLG), fiber optic gyroscopes (FOG) and hemispherical resonant gyroscopes (HRG). This could enable a wide range of man portable targeting and navigation systems and unmanned aerial vehicles (UAVs). This could also enable many satellite pointing, telescope pointing and the navigation and control of ultraminiaturized satellites.

Keywords:
temperature stability, temperature stability, Gyroscope, Packaging, Vibration, MEMS, Accelerometer, Vacuum, oven control

Phase II

Contract Number: N00014-13-C-0330
Start Date: 9/9/2013    Completed: 3/8/2015
Phase II year
2013
Phase II Amount
$1,499,892
The objective of this proposal is to demonstrate a generic package that provides high vacuum, temperature control and vibration isolation for a wide range of high performance (tactical and navigation grade) micromachined inertial sensors. Inertial sensors (accelerometers and gyroscopes) are now widely used in consumer and industrial applications. However, for high performance navigation and targeting applications there are several packaging challenges which act as roadblocks to their commercialization including: i) their need for low vacuum pressures (

Benefit:
High performance (tactical and navigation grade) inertial sensors are a key technology for next generation navigation and targeting systems and will replacing much larger (> 100 times larger) ring laser gyroscopes (RLG), fiber optic gyroscopes (FOG) and hemispherical resonant gyroscopes (HRG). This could enable a wide range of man portable targeting and navigation systems and unmanned aerial vehicles (UAVs). This could also enable many satellite pointing, telescope pointing and the navigation and control of ultraminiaturized satellites.

Keywords:
MEMS, Packaging, temperature stability, Accelerometer, oven control, Gyroscope, Vibration, Vacuum