SBIR-STTR Award

In both the commercial and military electronics markets, there is a continuing trend to reduce size, weight, and overall equipment costs, while at the same time increasing functionality and improving reliability of the electronic circuitry. Integrated circuit manufacturers have addressed this need by integrating greater functionality directly onto the silicon chips, thus yielding the System-on-Chip approach. This technique, however, only addresses a portion of the problem. While it does provide for a reduction in size and cost while increasing overall functionality, these ICs still need to be packaged into functional end applications. The ICs typically still require a large number of discrete circuitry to support their functionality. The integration of these ICs and required discrete circuitry into a single end application package is the System-in-Package (SiP) approach. Newer packaging techniques, improved material sets, and new methods of passively integrating circuitry are being developed which allow for a further reduction in size and cost in the final package. Omega Wireless Solutions is adept at advanced packaging, passive integration, and electromagnetic simulation, and has the tools and abilities necessary to integrate the U.S. Navys Quadrature LINC architecture into a small form factor utilizing the latest SiP techniques.

Benefit:
The development of a Vertically Integrated Advanced Microwave Package (VIAMP) is a natural extension of on-going funded research and will yield a viable packaging approach for military as well as commercial markets. The VIAMP will find a multitude of applications and uses ranging from highly integrated solutions to products requiring ultra-small form factors to mission critical circuitry requiring tightly controlled substrate characteristics. Furthermore, the development of the VIAMP will be an enabling technology for the continued size reduction required by many wireless markets such as cellular telephones, military unmanned aerial vehicle (UAV) applications, automotive and consumer electronics, surveillance applications, and advanced military handheld and airborne communications and data radios.

Keywords:
Systems-In-Package, Systems-In-Package, microwave packaging, Vertically Integrated Packaging, Passive Integration, Low-Temperature Co-fired Ceramic (LTCC)

In both the commercial and military electronics markets, there is a continuing trend to reduce size, weight, and overall equipment costs, while at the same time increasing functionality and improving reliability of the electronic circuitry. Integrated circuit manufacturers have addressed this need by integrating greater functionality directly onto the silicon chips, thus yielding the System-on-Chip approach. This technique, however, only addresses a portion of the problem. While it does provide for a reduction in size and cost while increasing overall functionality, these ICs still need to be packaged into functional end applications. The ICs typically still require a large number of discrete circuitry to support their functionality. The integration of these ICs and required discrete circuitry into a single end application package is the System-in-Package (SiP) approach. Newer packaging techniques, improved material sets, and new methods of passively integrating circuitry are being developed which allow for a further reduction in size and cost in the final package. Omega Wireless Solutions is adept at advanced packaging, passive integration, and electromagnetic simulation, and has the tools and abilities necessary to integrate the U.S. Navy's Quadrature LINC architecture into a small form factor utilizing the latest SiP techniques.

Benefit:
The development of a Vertically Integrated Advanced Microwave Package (VIAMP) is a natural extension of on-going funded research and will yield a viable packaging approach for military as well as commercial markets. The VIAMP will find a multitude of applications and uses ranging from highly integrated solutions to products requiring ultra-small form factors to mission critical circuitry requiring tightly controlled substrate characteristics. Furthermore, the development of the VIAMP will be an enabling technology for the continued size reduction required by many wireless markets such as cellular telephones, military unmanned aerial vehicle (UAV) applications, automotive and consumer electronics, surveillance applications, and advanced military handheld and airborne communications and data radios.

Keywords:
Quadrature Coupler, SIP, Embedded Filters, LTCC, High Power Couplers, Microwave Substrates, substrate