SBIR-STTR Award

The need for increased reliability coupled with reduced size and weight has demanded the evolution of manufacturing process technologies for printed circuit board assembly. Imbedded Component/Die Technology (IC/DT) will advance electronics packaging to the next level by transforming two-dimensional component placement into a three-dimensional (3-D) assembly with integrated thermal management. IC/DT enables the 3-D configuration of multiple systems thus achieving the cost/weight ratio advantage of using the smallest form and fit factor components available in a circuit card assembly. The objective of this research project is to develop a conceptual design using IC/DT to improve component performance, system capability, and product reliability of advanced interceptor seeker electronics. Removal of component-level packaging reduces assembly weight, electrical failure opportunities, electrical and thermal impedance, and valuable circuit card real estate. In Phase I, a manufacturing and assembly design methodology will be developed to integrate multiple advanced interceptor seeker electronics, such as the seeker IMU and image processor, into a high-density, miniaturized, light weight assembly. In collaboration with LMSSC, MSSA, and IBSi, a low-cost, highly-integrated, high-performance avionics package for the MKV kill vehicle shall be developed. This design methodology may be applied to a myriad of military interceptor products.

The need for increased reliability coupled with reduced size and weight has demanded the evolution of manufacturing process technologies for printed circuit board assembly. Imbedded Component/Die Technology (IC/DT) will advance electronics packaging to the next level by transforming 2-D component placement into a 3-D assembly with integrated thermal management. In Phase I, a conceptual design of a single, high performance avionics package for the miniaturized MKV Kill Vehicle (KV) was developed and includes the integration of multiple electrical subsystems [LMMFC’s mission computer, LMSSC’s image processor, and IBSi’s navigation system, which includes MSSA’a planar MEMS IMU and a GPS] in a collaborative effort with Lockheed Martin (LMMFC and LMSSC), MSSA, and IBSi. Phase II will entail a printed circuit board design of a subset of the proposed Phase I avionics system, a fully functional MEMS IMU assembly, using IC/DT to exploit the benefits of unpackaged components, namely bare die. During the Phase II effort, the MEMS IMU in addition to its control and readout electronics shall be designed and manufactured resulting in an engineered prototype as a proof of principle demonstration for future testing and continued integration of KV avionic subsystems into a single, advanced, integrated avionics module.

Keywords:
Robustness, Thermal Management, Integrated Avionics, Miniaturization, Manufacturing Process, Reliability, Packaging Technology, Imu