SBIR-STTR Award

Two-Phase, Vibration-Induced Droplet Atomization (VIDA) Thermal Management of High Heat Flux Power Electronic Modules
Award last edited on: 3/12/2007

Sponsored Program
SBIR
Awarding Agency
DOD : Navy
Total Award Amount
$70,000
Award Phase
1
Solicitation Topic Code
N03-055
Principal Investigator
Samuel Heffington

Company Information

Nuventix Inc (AKA: Innovative Fluidics Inc)

1909 West Braker Lane Building E Suite 100
Austin, TX 78758
   (512) 382-8100
   info@nuventix.com
   www.nuventix.com
Location: Single
Congr. District: 10
County: Travis

Phase I

Contract Number: N65540-03-C-0056
Start Date: 9/22/2003    Completed: 3/20/2004
Phase I year
2003
Phase I Amount
$70,000
Vibration-Induced Droplet Atomization, or VIDA, is a thin-film spray cooling technology developed at Georgia Tech with tremendous potential for the thermal management of Power Conversion Modules for Configurable Zonal Systems (CZS). The patented VIDA technique uses a vibrating piezo driver in a self-contained cell to deliver a highly controllable, rapid-response, on-demand aerosol-sized water spray to hot electronic components. Vapor evaporated from the hot surface condenses on a secondary cooling loop, thus enabling efficient heat removal. Results show that a small charge can effectively manage high power densities with an extremely low ratio of power consumed to power removed and with very low flow rates. Through use of a small piezo pump, the system can be made orientation-independent. Cooling rates in excess of 100W/cm2 have been measured while keeping devices below 125C. It is anticipated the technique can be developed to deliver up to 1000 W/cm2 with optimizations described herein. Benefits The VIDA technology has the potential for delivering a method of high power-density thermal management in a relatively simple, low-cost configuration, in a low-profile form factor. Applications include cooling of military electronics, including lasers and radar components; high-power rack mount and blade servers and high-temperature "under-the-hood electronics." Keywords thin-film cooling, spray cooling , thermal management, microprocessor cooling

Phase II

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Start Date: 00/00/00    Completed: 00/00/00
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