The objective of this SBIR project is to identify the means to substantially reduce the size and weight of the ALQ-170 electronics package while improving threat signal fidelity and adding versatility. The initial effort consists of a study to baseline the current performance of the ALQ-170 and its subsystems, and identify areas where improvement is required. Next, subsystem performance specifications are generated. Then applicable modern technology and packaging techniques are investigated. Some areas to be investigated include high power microwave transmitters, microprocessor and digital electronics, microwave component and receiver technology, structural materials and design, high density packaging techniques, power supplies, cooling, and cables and connectors. These modern technologies are integrated with the performance requirements to produce a recommended design concept.
