Polyimide quartz multilayer board
Award last edited on: 3/23/2012

Sponsored Program
Awarding Agency
DOD : Navy
Total Award Amount
Award Phase
Solicitation Topic Code
Principal Investigator
Kevin K T Chung

Company Information

A I Technology Inc

70 Washington Road
Princeton Junction, NJ 08550
   (609) 799-9388
Location: Single
Congr. District: 12
County: Mercer

Phase I

Contract Number: N00164-87-C-0232
Start Date: 9/11/1987    Completed: 00/00/00
Phase I year
Phase I Amount
A polyimide based polymer alloy is proposed to be used as the matrix for a quartz filled multilayer circuit board. Polyimide which has thermal expansion coefficient (tec) of 30 ppm/deg c is substantiatly lower than that of epoxy (50-60 ppm/ deg c). The polymer alloy which consists of rigid-rodlike molecules, however, will have tec as low as 10-20 ppm/deg c. Quartz fiber filled in different geometric arrangements as well as quartz powder and flake will be studied for their effects on tec of the multilayer board. Emphasis will be on the fabrication procedures. Thermoplastic polyimide (tpi) based alloys can be processed using casting, extrusion, and modeling techniques. Thermoset polyimide based alloys can be processed using the same technology developed for epoxy. Methods to improve moisture resistance, thermal conductivity, and mechanical properties are also discussed.

Phase II

Contract Number: ----------
Start Date: 00/00/00    Completed: 00/00/00
Phase II year
Phase II Amount