A polyimide based polymer alloy is proposed to be used as the matrix for a quartz filled multilayer circuit board. Polyimide which has thermal expansion coefficient (tec) of 30 ppm/deg c is substantiatly lower than that of epoxy (50-60 ppm/ deg c). The polymer alloy which consists of rigid-rodlike molecules, however, will have tec as low as 10-20 ppm/deg c. Quartz fiber filled in different geometric arrangements as well as quartz powder and flake will be studied for their effects on tec of the multilayer board. Emphasis will be on the fabrication procedures. Thermoplastic polyimide (tpi) based alloys can be processed using casting, extrusion, and modeling techniques. Thermoset polyimide based alloys can be processed using the same technology developed for epoxy. Methods to improve moisture resistance, thermal conductivity, and mechanical properties are also discussed.
