Phase II research effort will be concerned with the five (5) major areas: two alternative aluminum nitride deposition processes, cost effective fabrication processes, design of special low cost fabrication and in-process test equipment, design and testing of a low cost dissipative test and burn-in carriers, electrical design and characterization of 50 ohm package transmission elements. Two types of aluminum nitride deposition processes will be evaluated; vacuum plasma torch spraying and magnetron sputter-up. Magnetron sputter deposition would have a deposition rate approximately 100 times greater than the reactive sputter deposition evaluated in Phase I. The fabrication process, which will be developed, will be cost effective in the range of 1 to 1,000 production units. Fifty ohm package transmission impedance will be developed in order to maximize device density and optimize power transfer.
