SBIR-STTR Award

Presently there are many problems with the available in the market. This research project proposes a VLSI packaging system which can provide enhanced thermal management because of the use of sputtered aluminum nitride, copper clad invar core material in the substrate and

Phase II research effort will be concerned with the five (5) major areas: two alternative aluminum nitride deposition processes, cost effective fabrication processes, design of special low cost fabrication and in-process test equipment, design and testing of a low cost dissipative test and burn-in carriers, electrical design and characterization of 50 ohm package transmission elements. Two types of aluminum nitride deposition processes will be evaluated; vacuum plasma torch spraying and magnetron sputter-up. Magnetron sputter deposition would have a deposition rate approximately 100 times greater than the reactive sputter deposition evaluated in Phase I. The fabrication process, which will be developed, will be cost effective in the range of 1 to 1,000 production units. Fifty ohm package transmission impedance will be developed in order to maximize device density and optimize power transfer.