Over the past 30 years, additive manufacturing has evolved from printing layers of 3D bonded plastic coated paper to create 3D rapid prototyping objects maturing to sophisticated rapid manufacturing that can directly sinter 3D metal parts using high power, high speed lasers, known as Direct Metal Laser Sintering.Current Radiation Hardened (RH) shields are made with high density and hardness materials that have the physical properties to stop and shield radiation from effecting electronics.Unfortunately, these materials also have high melting and associated sintering temperatures baring direct 3D printing of high Z material directly onto the package without damaging the electronics content.Other, continuous additive manufacturing techniques using multiple methods to spay or adhere polymer binders as a topcoat to FBGA is limited to 60% high Z embedded material due flow requirements during manufacture.NexGenSemi Corporation is presenting an alternative ambient temperature 3D patterned growth process to print high Z materials to create packaged RH electronics in original fit, form, function packaging.This growth process uses a broad array of commercially available feedstock material that can be deposited with Z axis growth independent of print throughput offering highly competitive costs for broad application on leading edge electronics.Approved for Public Release | 17-MDA-9395(24 Oct 17)
