SBIR-STTR Award

This Phase I SBIR program will initiate the development of a large-format mid-wave infrared (MWIR) scene projector based on the Company's existing membrane-mirror spatial light modulator technology. The scene projector is based on a VLSI membrane-mirror light modulator (VLSI-MMLM) that uses a deformable membrane mirror to modulate an off-chip light source. Prototype infrared scene projectors of this type with 200x200 pixels have been demonstrated in the 3-5 µm MWIR band, and their operation at temperatures down to -35 C has been demonstrated. The goals of this project are to scale up the spatial resolution to 1024 x 1024 pixels, increase the contrast ratio to 500:1 and the framing rate to 200 Hz. In particular, the Phase I program will begin the VLSI driver chip redesign and simulation work to achieve an array of 1024 x 1024 chip electrodes with at least 40 V of output. The design scale up from the the current 20mm x 20mm chip to a 44mm x 44mm chip involves reticle stitching technology. In addition, the Phase I program will undertake the initial MEMS process and redesign optimization steps required to support the 40 µm pixels for high contrast. The optional program will also include preliminary work on the packaging, mounting, and interface electronics and hardware to support the new die size format. Future Phase II work would include the prototype modulator fabrication in the 1024 x 1024 pixel large-format die and ancillaries, integration into a coolable package, and demonstration of the resulting infrared scene projector.

Keywords:
Low Temperature, Large Format, Infrared Projection, Deformable Mirror, Spatial Light Modulator, Hardware-In-The-Loop, Vlsi, Mems

This Phase II SBIR effort will focus on the design and fabrication of a wide-format mid-wave infrared scene projector (with 1000x500 pixels, each 40 um on a side) based on VLSI-Membrane-Mirror-Light-Modulator (VLSI-MMLM) technology. They key technologies that will be developed in this program to make this project successful include: (1) reticule stitching of the required large-area high-voltage VLSI driver chip, (2) The development of polymer MEMS structures to support the membrane mirror atop the large rectangular chip, and (3) the development and implementation of an off-axis Three-Mirror, Anastigmatic (TMA) optical readout system to eliminate stray light and thereby optimize the contrast ratio of the system. The electronic interface to the VLSI-MMLM will also be updated to be fully compatible with the large-format VLSI chip and to support its operation. The modulator will employ a mostly-metal membrane for low-temperature operation down to -35C. In addition to low temperature operation, the performance goals of wide-format projector include: 2,000:1 contrast ratio, 120 Hz framing rate and flickerless operation with at least an 8°field of view.

Benefit:
This research is expected to lead to a family of compact, low-cost, high-performance large-area infrared projectors that offer operation over a large temperature range, large numbers of pixels, high temperature resolution, and multispectral operation ranging from the visible to the long-wave infrared. Commercial applications of the technology include: (1) multi-spectral and infrared scene projectors for government and commercial testing applications (2) visible, mid-wave and long-wave infrared shutters, (3) spatial light modulators for optical signal processing and adaptive optics, (4) sensors and systems for industrial inspection, robotic vision and medical imaging, and (5) large-screen projection displays such as digital cinema.