Silicon based charged couple devices (CCD) have been the workhorse of solid state imaging technology for use in the visible spectrum. Infrared systems are confined to exotic compound semiconductors that add an order of magnitude onto the cost. Solid state ultraviolet systems are still in their infancy. As the need for higher performance and need for hyperspectral response is ever increasing, these systems are being pushed beyond their limit. Townsend Science & Engineering will present a next generation hyperspectral imaging program in this Phase I proposal. In additionTS&E's hyperspectral imagers can take on any form factor, including curved surfaces to reduce optic complexities. The entire wing can become an imager
