SBIR-STTR Award

The existing generation of high performance dynamic IR scene projectors is incapable of simulating high temperature sources such as hot engine exhausts, rocket plumes or infrared countermeasures. The materials used in fabricating the current generation of devices are not stable at the high temperatures required (~2500 K or higher) - the pixel will melt well before reaching these temperatures. Resistive heating technology is the most mature of the myriad IR scene projection technologies available today, and hence the most appropriate springboard for the development of high dynamic range IR scene projectors. Attaining the temperatures required will involve numerous development tasks, the most challenging of which is selecting the materials of which the emitter pixels are fabricated. These new materials must 1) be stable (i.e. repeatable) over the temperature range 300 K - 3000 K, 2) possess thermo-physical properties suitable to the apparent temperature and speed specifications and 3) be compatible with thin-film processing requirements. This proposal will, via research, identify candidate materials for fabricating the next generation of high temperature emitters. Methods for measuring the relevant thermo-physical properties of these materials will be researched, and a list of vendors capable of depositing, patterning and etching these materials will be generated. Anticipated Benefits/Commercial Applications: The primary result of the proposed work will be a list of materials that are suitable for the fabrication of emitter pixels capable of attaining MWIR apparent temperatures in excess of 2000 K, thereby substantially reducing the risk associated with development of the next device generation. The high temperature materials developed under this effort will provide substantial benefits to the existing generation of low temperature devices as well in the form of improved stability, thus the potential market includes the entire IR scene projection community. The entire hardware in the loop test community will benefit directly from the development work proposed here, as will programs that rely on using infrared sensors to detect high contrast targets. Commercial products designed for fire fighting or search and rescue could use this product for developmental testing or training as well.

Keywords:
IR, infrared, projector, hardware-in-the-loop, HWIL, resistor array, boost phase intercept, high temperature materials

Attaining the temperatures required for simulating future MDA weapons systems such as targets with hot engine exhausts, rocket plumes and infrared countermeasures will require development on numerous fronts, the most challenging and difficult of which is the selection of the materials of which the emitter pixels are fabricated. Resistive heating technology is the most mature of the myriad IR scene projection technologies available today; and hence is the most appropriate and realistic foundation on which to base the development of the next generation of high dynamic range IR scene projectors. Unfortunately, the materials used in fabricating existing generation of devices are not capable of withstanding the ultra-high temperatures required for the next generation of devices. Materials research for this application, performed in a phase 1 effort, has turned up several potential material systems that are expected to be stable at the extreme temperatures required for the next generation of devices (~2500 K or higher). The work outlined in this proposal is aimed at selecting the most promising of the material systems (and deposition techniques) based on process development, annealing experiments and measurements of the properties relevant to ultra-high temperature IRSP performance. Test pixel arrays will be fabricated and tested.

Keywords:
HIGH TEMPERATURE MATERIALS, RESISTIVELY HEATED INFRARED SCENE PROJECTOR, HWIL, RESISTOR ARRAY