Optoelectronic interconnect modules are proposed which use vertical-cavity lasers and InGaAs detectors which allow very simplified drive conditions and receiver designs. The modules are assembled using an adaptation of standard hermetic packaging technology. Backside illuminated photodetectors and bottom emission vertical-cavity lasers are mounted on a window and are wirebonded to the electrical components. Taking advantage of the low divergence beam qualities of the lasers, the modules are designed for both free space and fiber ribbon applications with a minimal retooling. A complete board-to-board interconnect solution is proposed including the transmitter and receiver modules, Multiplex and demultiplex circuits and data bus interface. The proposed approach uses several chips rather than a fully integrated solution to provide the widest applicability and minimize the market risk in this rapidly evolving field. The proposed modules provide low cost solutions to the growing bandwidth requirements of computer data buses. The modules will have significant impact on the commercial and military sectors requiring low cost, high power computing systems.
Keywords: Optoelectronic Laser Vertical-Cavity Hermetic Packaging High Speed Bus Hologram
