NEMP (Nuclear Electro-Magnetic Pulse), lightning strikes, high powered EMI (Electro-Magnetic Induction), or ESD (Electro-Static Discharge) can impress high transient voltages on wires connecting to electronic modules. These transients are potentially destructive to aircraft electronic components and can result in system failures. To eliminate or substantially reduce the effects of transients on electronic components, Dennis Ikola and Applied Concepts & Technologies (ACT) have patented (US Patent #5,201,885) and proposes the use of a technology, named the Grid System Matrix (GSM). This technology allows for the integration of transient suppression components into ARINC connectors thus absorbing transients before they enter into the electronic modules. the GSM technology uses a non planar die mounting technique allowing multiple transient suppression components to be placed in a high density configuration. The GSM structure is capable of dissipating power 4 to 6 times that of other packaging techniques in the same profile. In testing at Honeywell's Commercial Flight Systems a GSM prototype sustained 1,000 simulated lightning strikes without component degradation and provided adequate transient suppression. this Phase I program will design a connector with built-in transient suppression. The Phase II program will build and evaluate prototype units. The ARINC connector market is estimated at over $50 million yearly, of this, approximately $40 million includes a form of transient protection. Applications include: airborne controls, mobile communications, and computer equipment. A business can be established on a reasonable capture of this market.
