Silicon-based sensors are central to particle physics experiments and particle tracking detectors. New- generation Large Focal Plane Arrays (LFPAs) cover areas that extend beyond several square meters. Distributing power and transporting data across such areas while maintaining good signal integrity is a complicated challenge. Tiling the detector on an organic interposer would be far too expensive and take too much space while offering little to no advantage regarding signal integrity. Passive silicon interposers are much less expensive and more integrable but would worsen signal integrity because of their inherent higher dielectric constant. Active interposers are a good compromise from the economic and signal integrity standpoint; unfortunately, their yield trends to 0 for areas greater than a reticle size, making this technology incompatible with our application. NHanced proposes to duplicate the behavior of a high-yield, low-cost active interposer by printing active microcomponents on a passive interposer with our die-to-wafer micro-transfer printing (MTP) technology. This will resolve the signal integrity and power distribution limitations. We will demonstrate our technology capabilities by designing, fabricating, printing, and testing analog and digital repeaters and potentially 5-12V input DC-DC converters on a passive silicon interposer test wafer. Phase I will pave the way for the fabrication, assembly, testing, and demonstration that will occur during Phase II. More specifically, we will (1) complete the design and physical implementation of a library of analog and digital repeater elements, (2) complete the design of a passive silicon interposer test wafer, incorporating test structures (daisy chained routing for analog and digital signals, power distribution scheme, serpentine wiring) that will allow us to assess, measure, and compare signal integrity performance gain, (3) perform cost vs. risk analysis of various scenarios to obtain bare dies of DC-DC converters for Phase II, and (4) do the necessary planning for a successful Phase II demonstration. The MTP technology is fully characterized and will not need any development in this effort. The technology that NHanced intends to demonstrate provides a high-yield low-cost alternative to active interposers. We estimate the active interposer market potential to attract 5% of the advanced PCB market, which is estimated to be $4.5 billion by 2024. That market space would include items like cell phones, HPC, processor modules, tablets, and PDAs. Other niche markets, like implantable medical devices, would significantly benefit from the affordable alternative to active interposers embodied in our proposed technology. NHanced is primarily interested in the low-volume segment of the market, which is estimated to represent $50M. In addition, we anticipate licensing our technology for greater than $1M/year to manufacturers in the high volume sector.
