SBIR-STTR Award

Radiation-Tolerant, High Thermal Conductivity Adhesives for High Energy Physics Detector Applications
Award last edited on: 12/31/2019

Sponsored Program
SBIR
Awarding Agency
DOE
Total Award Amount
$199,956
Award Phase
1
Solicitation Topic Code
31g
Principal Investigator
Andrea Haight

Company Information

Composite Technology Development Inc (AKA: CTD)

2600 Campus Drive Suite D
Lafayette, CO 80026
   (303) 664-0394
   N/A
   www.ctd-materials.com
Location: Single
Congr. District: 02
County: Boulder

Phase I

Contract Number: DE-SC0019798
Start Date: 7/1/2019    Completed: 6/30/2020
Phase I year
2019
Phase I Amount
$199,956
High Energy Physics experiments utilize highly specialized detector systems that are dimensionally stable and have very low mass to reduce the detected particle scattering. Current detector systems make significant use of adhesives in assembling the components of the system. In order to meet future requirements, radiation-tolerant adhesives with high thermal conductivity are needed; a room temperature thermal conductivity on the order of 4 W/m-K is desired. Composite Technology Development, Inc. (CTD) will explore multiple pathways to increasing the thermal conductivity of resin systems used in composite fabrication and adhesive systems. Primarily, CTD will be focusing on resin systems known for their radiation tolerance (e.g., cyanate ester). High thermal conductivity fillers such as aluminum nitride and graphene will be considered in addition to structured nanoscale materials such as carbon nanotubes. In order to improve the detector?s accuracy, the filler radiation length should be optimized so that particle scattering is minimized. The objective of this Phase I SBIR effort is to develop a radiation tolerant adhesive formulations with high thermal conductivity to specifically address requirements unique to high energy physics detector applications. This objective will be accomplished by evaluating low mass, high thermal conductivity nanoparticle fillers dispersed in radiation-tolerant resins compatible with adhesives applications. Filler selection and loading level will be guided by a combination of thermal conductivity modeling and prediction of system radiation length to minimize particle scattering. Adhesion performance of candidate materials will also be evaluated.This program provides a generalized approach to thermal management in composites and adhesives. Thermally conductive resins are expected to enhance the performance of detectors in high energy physics experiments, ultimately leading to improved particle detection applicable to medical and other advanced imaging applications. Applications are also expected in next- generation, higher field superconducting magnets, based on newer high temperature superconductors (HTS), where quench protection is critical for reducing risk. Additional application areas include the aerospace industry (e.g., satellites, space-based antenna systems) and advanced electronics.

Phase II

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Start Date: 00/00/00    Completed: 00/00/00
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Phase II Amount
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