Advanced semiconductor devices are the beating heart of 21st Century technology.The mission critical role that these devices play demands exceptional levels of reliability.When a semiconductor device does fails, it is essential that the cause of the failure is identified as quickly as possible.Because a devices chip is encapsulated in a thermoplastic package, a significant amount of intricate material removal must be performed before a chips failure location can be observed directly.However, this material removal is generally performed manually and critical forensic evidence is often destroyed during sample preparation.To address the limitations of current sample preparation techniques, a Modular Cluster Tool (MCT) is proposed.This system mates high precision chip manipulation and advanced non-contact metrology with existing material removal tools.The MCTs modular design allows it to perform a wide range of material removal tasks on a variety of different semiconductor devices.A high level of operational autonomy minimizes human involvement in the sample preparation process.
