This SBIR Topic endeavors to address the in-transit risks associated with shipment from DLA centers to the end user, and in particular the risk of tampering or insertion of counterfeit materials without the shipper or receiver being able to detect tampering while in route. The proposed Tamper Resistant/Anti-counterfeit Packaging and Labeling Innovation Experiment (TRAPLINE) Research and Development (R&D) will address this issue as follows: 1. The proposed R&D will demonstrate an innovative emerging industry standard anti-tamper/anti-counterfeit combination of technologies that directly address the problem-statement of this SBIR Topic. It presents a method if used that would indicate that a package has been subject to tamper. 2. The Proposed R&D has its foundation in existing commercial technologies and process that can be evolved to be employed within DLA. 3. The Proposed R&D is compatible with and complimentary to existing/other anti-tamper technologies creating the option for multi-factor authentication of packaging and labeling (e.g., barcode, security mark, holographic packing tape, RFID) to reduce the risk of undetected tampering, and increase adversary work-factor to defeat the anti-tamper/anti-counterfeit technologies. 4. The proposed R&D has both commercial and military/government utility enabling it to be employed upstream within the DLA supply chain and into wider commercial markets.
