NOVELX, Inc. proposes to develop and market an innovative miniaturized modular scanning electron microscope (SEM) for commercial and military applications. The Phase I technical objective is to investigate the technical feasibility of building a high-resolution, low-cost, miniature SEM that combines high-performance imaging with a proven manufacturable process. The miniature modular SEM (mmSEM) will nominally operate at 1keV at 1nA and achieve <10nm resolution. Several novel technologies and innovations will be incorporated into the NOVELX column. The machined components and hand-wrapped electromagnetic coils, common to a conventional SEM, will be replaced by all electrostatic micromachined, batch-fabricated silicon components using micro-electromechanical systems (MEMS) technologies. Batch processing will drive the component costs down while MEMS micromachining and silicon technologies guarantee that the dimensions of the components will be delivered precisely as designed. These technologies also guarantee that all components will meet the specifications and exceed the required tolerances. The result will be predictable, uniform column operation. The silicon components will be packaged using advanced integrated packaging technologies. These technologies are commonly used to fabricate small packages with high density interconnects in high-volume production. The NOVELX design eliminates individually wired interconnects common to conventional SEMS and replaces them with high density, batch-processed, printed circuitry. The mmSEM will be packaged in a tabletop or portable format and enable inspection of structures and devices, insulating and conductive, as well as biological materials with nanometer resolution
