SBIR-STTR Award

Gate Oxide for High Speed GaAs IC Circuits
Award last edited on: 1/27/2005

Sponsored Program
SBIR
Awarding Agency
DOD : DARPA
Total Award Amount
$1,170,360
Award Phase
2
Solicitation Topic Code
SB992-038
Principal Investigator
David Braddock

Company Information

Osemi Inc (AKA: Ovation Industries Inc~Ovation Semiconductors Inc~R Beam Epitaxy)

6492 318th Street
Cannon Falls, MN 55009
   (507) 285-4490
   info@osemi.com
   www.osemi.com
Location: Single
Congr. District: 02
County: Goodhue

Phase I

Contract Number: DAAH0100CR015
Start Date: 11/29/1999    Completed: 7/18/2000
Phase I year
1999
Phase I Amount
$99,000
We propose to take the first steps in demonstrating a new class of high frequency FETs by demonstrating a gate oxide for GaAs and InP MOSFETs. In this work, Gallium based oxides will be grown by MBE using a specially developed effusion cell that is uniquely capable of high temperature operation in the presence of oxygen. In addition, a new type of atomic oxygen source will be employed that does not damage the semiconductor-Oxide interface. We will use this new MBE technology to (1) optimize the nucleation of oxide on GaAs and InP, (2) grow bulk oxide films with a bandgap in excess of 4.5eV, (3) and produce oxide films that possess good interface properties and a low residual conductivity. The materials will be characterized using techniques including ellipsometry, Photoluminscence, C-V, and I-V measurements as a function of temperature. In addition, a new type of MBE system that is uniquely suited to the high quality growth of gate oxides on III-V semiconductors will also be designed during this Phase I effort.

Keywords:
Gate Oxide; MBE; FET; MOSFET; CHFET; GAAS; INP; MM-WAVE

Phase II

Contract Number: DAAH01-02-C-R028
Start Date: 1/3/2002    Completed: 3/1/2004
Phase II year
2002
Phase II Amount
$1,071,360
We propose to continue our extensive research and development effort regarding the demonstration of a high performance GaAs MOSFETs for very high speed low power VLSI applications. We intend to achieve this goal through a program that integrates advances in MBE materials growth and MOS Device Technology for Compound Semiconductors. Through the course of this work, we expect to change the face of the IC technology by providing the foundation for the first manufacturable MOSFET IC technology for compound semiconductors