We propose a new concept, device/package two-level integration, to make low cost, compact optoelectronic modules. The main idea is to incorporate device packaging into the device fabrication process so that the packaging can, to a large extent, be conducted in batch process. However, this new integration concept becomes practical and advantageous only if it does not disturb the device design and complicate the entire process. To implement such an idea, we invent a new technology, solid phase fusion (SPF), which can fuse III-V epilayers and devices to a number of patterned, nonplanar substrates including silicon. The SPF process can be conducted at a relatively low temperature and create reliable covalent bonding between the III-V material and the silicon substrate. Preliminary data showed that the SPF technology may be more flexible and reliable than the prevalent technologies such as flip-chip bonding and epitaxial liftoff. We will apply the SPF technology to integrate photonic device arrays with single mode fiber arrays to facilitate the light coupling for multi-channel transmitters and receivers. We will also use the SPF technology to integrate optical devices with their electronic circuits for multi-channel E/O and O/E conversions. Anticipated
Benefits: If successful, our research will provide a viable approach to fabricating low cost, compact, single and multi-channel optoelectronic modules. These modules will be used in optical communication networks such as optical LAN, MAN, and fiber-in-the-loop (FITL), and will be important for optical interconnects and computer networks.
