The present trend in the packaging of advanced integrated circuit chip is toward various types of multi-chip modules (MCM). Of these, MCM-D employing film deposition is the one most capable of supporting hich system performance. This proposal considers MCM-D as the basis for implementing a variety of thin-film layers which could integrate digital and analog functions into a single miniaturized system package. These layers might be conductive or superconductive, magnetic or ferro-electric, as well as dielectric insulating layers, deposited in a multilayer process. Having defined the material choices from general system requirements, the optimization of the system is then achieved by optimizing the performance ofthe components and assuring compatible communication between them. Voltage levels of operating temperatures are key adjustable variables for the system. The trend for CMOS fabrication is toward the continuing reduction of IC feature size. Toward this end, voltage reduction and the accompanying reduced theral dissipation must be primary objectives. It is clear that these objectives can be achieved by lowering operating temperatures. The Phase I effort would examine a specific system of military interest - a microwave receiver, to assess the application of these principles to produce a conceptual optimization of the packaged system, namely, a cryocooler. Anticipated
Benefits: All commercial high-performance electronics which comprise of digital and analog functions will benefit from this development. Work stations and higher level computers would have thier central processing boards replaced by optimized cryoelectronic MCM-Ds, since a small refrigerator could easily be made as part of the chassis.
Keywords: ELECTRONICS PACKAGING MULTI-CHIP MODULES (MCM0 THIN FILM CRYOCOOLER MULTILAYER PROCESS
