SBIR-STTR Award

A Novel Ultrasonic Technique for Quantitative Bond Strength Assessment
Award last edited on: 9/11/2002

Sponsored Program
SBIR
Awarding Agency
DOD : DARPA
Total Award Amount
$85,223
Award Phase
1
Solicitation Topic Code
DARPA93-022
Principal Investigator
Tanios Honein

Company Information

General Science & Technology

491 Macara Avenue Suite 1007
Sunnyvale, CA 94085
   (408) 737-9212
   N/A
   N/A
Location: Single
Congr. District: 17
County: Santa Clara

Phase I

Contract Number: ----------
Start Date: ----    Completed: ----
Phase I year
1994
Phase I Amount
$85,223
The objective of this proposal is to demonstrate the feasibility of a previously unexplored ultrasonic technique for nondestructive evaluation of adhesive bond strength. The successful completion of this project will lead to a small, portable, and commercial instrument for quantitative assessment of bond quality both as initially fabricated or after being subjected to extreme (hot/wet) environments. Anticipated

Benefits:
This project will demonstrate the feasibility of a technique which can be developed into a commercial product for bond strength evaluation. Economical, quantitative, simple, inexpensive, and nondestructive measurements will have a great impact on adhesive bond technology in the aerospace, car, semiconductor, and electronic packaging industries, among others.

Phase II

Contract Number: ----------
Start Date: ----    Completed: ----
Phase II year
----
Phase II Amount
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