
Micromachined Silicon Temperature Extreme Sensor Requiring No Power SourceAward last edited on: 3/26/2002
Sponsored Program
SBIRAwarding Agency
DOD : DARPATotal Award Amount
$700,000Award Phase
2Solicitation Topic Code
ARPA93-057Principal Investigator
Christopher BangCompany Information
Phase I
Contract Number: DAAH01-94-C-R062Start Date: 5/18/1994 Completed: 12/2/1994
Phase I year
1994Phase I Amount
$100,000Benefits:
The sensor can be used in applications in which power source usage is impractical (e.g., in mobile personnel) and where expense must be limited (e.g., in shipping containers). In DoD applications, the proposed microsensor can be used for monitoring temperature exposure of personnel, food, and medical supplies in the field. Since the sensor will be small, it is well suited for such applications in which weight and size of added instrumentation is critical. Additionally, the sensor has many private sector applications; for example in shipping and tire industries.
Phase II
Contract Number: DAAH01-95-C-R158Start Date: 8/1/1995 Completed: 7/31/1997