Anticipated benefits/potential applications:Anticipated benefits for the federal government include the ability to allow manufacture of low-cost high-yield VLSI circuits for wide-spread DoD usage, and to allow fabrication of cost-effective military custom asic chips with features at or below 0.25 micron (using photolithography, e-beam or x-ray lithography). Potential commercial opportunities include going into large-scale production of the resist for submicron as well as sub-half-micron utilization.
