
A Modeling and Integration Framework for Semiconductor ManufacturingAward last edited on: 3/2/07
Sponsored Program
SBIRAwarding Agency
DOD : DARPATotal Award Amount
$812,858Award Phase
2Solicitation Topic Code
SB911-031Principal Investigator
J J PanCompany Information
Enterprise Integration Technologies Corporation
985 El Capitan Drive
Danville, CA 94526
Danville, CA 94526
(925) 244-5515 |
N/A |
N/A |
Location: Single
Congr. District: 11
County: Contra Costa
Congr. District: 11
County: Contra Costa
Phase I
Contract Number: DAAH01-91-C-R193Start Date: 8/30/91 Completed: 2/28/92
Phase I year
1991Phase I Amount
$49,110Phase II
Contract Number: DAAH01-93-C-R142Start Date: 4/14/93 Completed: 4/14/95
Phase II year
1993Phase II Amount
$763,748Benefits:
UFM enables industry to meet DOD's need for agile (high mix, low volume) production, with modularized equipment that can be readily plugged into the CIM environment - a first step toward ARPA's CSPED vision. UFM's view of an integrated physical/virtual factory will open up new opportunities for TCAD vendors to apply their simulation technology on the factory floor. UFM will be developed in collaboration with a government-operated R&D fab line, and will provide a continuing pipeline for transferring ARPA-sponsored research results to the semiconductor industry.