We propose to develop a modular family of CIM software for "agile" semiconductor manufacturing. The software consists of modules known as Unified Factory Modules (UFMs) that communicate through a distributed information service (DIS). Each UFM is a building block that models one element of a flexible factory, such as a piece of equipment, a workcell, or event the entire fab line. It encapsulates all of the application software, parameters and state associated with its component, providing a consistent view of that component from both a virtual and physical factory perspective. The approach will also encourage manufacturing personnel to build and maintain their own factory models, allowing "plug-and-play" equipment or workcell to be modularly installed in a factory. UFMs will be implemented on DIS, an OMG-compatible service for messaging and information sharing originally developed by EIT for Stanford. UFMs register their interests and capabilities with DIS, which is then responsible for routing a module's messages to others with the appropriate expertise or need to know. Systems structured in this way are inherently open, scalable, and reliable. The DIS framework is fully compatible with open protocols emerging from standardization efforts by CFI, Sematech and others. Anticipated
Benefits: UFM enables industry to meet DOD's need for agile (high mix, low volume) production, with modularized equipment that can be readily plugged into the CIM environment - a first step toward ARPA's CSPED vision. UFM's view of an integrated physical/virtual factory will open up new opportunities for TCAD vendors to apply their simulation technology on the factory floor. UFM will be developed in collaboration with a government-operated R&D fab line, and will provide a continuing pipeline for transferring ARPA-sponsored research results to the semiconductor industry.
