Advanced hybrid packaging for MWIR FPA devices has considerable challenges in terms of increasing pixel density. These processes are based on Indium bumping; however, the current approach to deposition has scaling and cost issues. EnerGaia has a technology based on acoustic electroless deposition which can meet these requirements. Ultrasonic energy coupled to a plating solution has been proven to replace additives and improve uniformity by 40%. The additional energy source improves agitation, increases the kinetic energy of the ions, and reduces the boundary layer at deposition. Parameters such as grain size and crystal composition can be controlled. The EnerGaia process minimizes chemistry usage, which reduces cost as well as environmental waste.
Keywords: Plating, Bumps, Electroless, Ultrasonic, Packaging, Flip Chip
