This is a proposal to research new methods of coating small particles using a water-based electroplating process. These methods would build upon existing technology, in which small particulates are placed into a metallic-ion-containing electrolyte solution inside an electroplating device. The particulates are repeatedly stirred, allowing sedimentation to occur by gravity until a sedimentation layer of loosely contacted particles is formed on the cathode plate. An electric current is created from the electromotive potential that exists across the anode and cathode plates. The stirring, sedimentation and electroplating processes are performed in sequence. Electroplating is interrupted during the stirring and seminentation steps, and stirring immediately follows electroplating.
Benefits:Metal coating micron and sub-micron particles may permit micro-structural homogeneity through controlled shape, size, spatial distribution, and size distribution of discontinuously reinforced particles. This will result in enhanced tensile ductility, hot and cold workability, and fracture toughness. All of these and other material property benefits which result from achieving complete and uniform coatings, as well as the ability to control coating thicknesses, will significantly enhance their mechanical properties. This would be particularly useful in the manufacture of various caliber munitions and mortar systems, allowing for increased penetration and other performance benefits.
Keywords:metal, coated, particles, nickel, aluminum, copper, tungsten, encapsulation
