The overall objective of the program is to develop novel MEMS packaging concepts using SMA-based smart structures, especially to enhance sealing reliability, as well as flexibility in assembly/disassembly/packaging. The specific objectives of the program can be enumerated as follows: (1) Feasibility study on SMA micro-material system selection, Ferro-based SMA and SMA (Ferro plus NiTi) hybrid composition. (2) Investigation of micro-manufacturing processes, including micro-fabrication, thermalmechanical stabilization and shape memory training. (3) Evaluation of physical and mechanical properties, and relationship between material composition/processing condition and resulting characteristics.
Keywords: SHAPE MEMORY ALLOY (SMA), FE BASED SMA, MEMS, SEALING, ACTUATION, MAGNETIC FIELD, PROCESSING
